特性: | KLIPPEL R&D系统 |
|---|---|
| 杨氏E模量 | MPM |
| 模态损耗因子η | MPM, SCN, HMA |
KLIPPEL R&D系统 (开发)
模组 | 备注 |
|---|---|
| 材料参数测量 (MPM) | MPM通过使用振动条束技术动态测量平坦材料样品的杨氏E模量和损耗因子η。这些参数在低频(<100Hz)处测量，也应该在这些频率处被应用到FEA中。然而，该简单技术对检查材料性能一致性很有帮助，也简化了驱动单元和软部件制造商之间的交流。 |
SCN给出最终应用中所用形状部件的固有频率和模态损耗因子。将有限元模型预测的固有频率拟合到被测频率，来找到杨氏E模量。该方法给出了最可靠的结果，并显示了音频带中参数对频率的依赖性。 | |
| 高阶模态分析 (HMA) | 使用激光扫描仪测量来自动识别模态参数（模态共振频率、阻尼、增益）和特征振动模式（模式形状）。这将膜片上复杂的振动模式分为易于理解的独立振动分量。模态参数可用于调整具有相同“模态视图”的有限元模型。该模块提供了膜片形变的动画视图，以定位非线性失真的潜在来源。 |
美国试验与材料学会
ASTM E111-04 Standard Test Method for Young's Modulus, Tangent Modulus, and Chord Modulus (ASTM E111-04 杨氏模量、正切模量和弦切模量的标准测试方法)
ASTM E756 Standard Test Method for Measuring Vibration-Damping Properties of Materials (ASTM E756 测量材料减振特性的标准测试方法)
W. Klippel, et al., “Distributed Mechanical Parameters of Loudspeakers Part 1: Measurement,” J. of Audio Eng. Soc. 57, No. 9, pp. 500-511 (2009 Sept.).
W. Klippel, et al., “Distributed Mechanical Parameters of Loudspeakers Part 2: Diagnostics,” J. of Audio Eng. Soc. 57, No. 9, pp. 696-708 (2009 Sept.).
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J. Wright, “Finite Element Analysis as a Loudspeaker Design Tool,” Paper MAL-11; Conference: AES UK Conference: Microphones & Loudspeakers, The Ins & Outs of Audio (MAL); March 1998.